ThermoChuck®
TP03500



for the testing, cycling and characterization of wafers and other flat devices at precise temperature from:

 -65°C to +300°C

Outstanding Features:

• Patented TP03500 ThermoChuck design provides exceptional thermal and mechanical stability and precision.
• Superior Temperature Uniformity:
  

  At temperatures to +200°C: ±0.5% or ±0.5°C, whichever is greater
  At temperatures = or > 200°C: ±1.0% of set temperature

• Surface Flatness

  @ +200°C: <12.5 microns ( 200 mm ); <25 microns (300mm)
  @ +300°C: <25 microns

• Surface to Base Parallelism: <20 microns @ +200°C
• Surface Isolation: > 109 ohms standard; >1014 ohms available
• Surface Capacitance at ambient:

  200 mm chuck: <750 pf standard, < 250 pf option available
  300 mm chuck: <800 pf standard, < 500 pf option available

• Deflection:

  200 mm: <15 microns at 65 Kg
  300 mm: <6 microns at 50 Kg

• Low noise DC Control System keeps electrical noise to a minimum.
• Modular System Design for convenient, cost-effective system upgrades as wafer diameter and temperature requirements change.
• CE Approved, ETL listed for U.S.A. and Canada and Compliant with SEMI S2-93A standards.

Standard Features:

• Temperature Stability ±0.1°C
• Precise temperature control and accuracy
• Ramp/soak/cycle programming is controllable from front panel or via remote interface.
• IEEE-488 and RS232 remote interface included.
• Integrates with most major wafer probing stations, laser trimmers and inspection stations.
• HCFC and CFC-free

Applications:

• Thermal cycling and steady-state thermal testing of wafers, hybrids and other flat devices at precise temperature
• Ultra low noise test applications
• High isolation for low leakage (femtoamp level), low capacitance test measurements; Co-axial and tri-axial configurations are available.
• Ideal for high power and high probe load applications
• Cold testing of wafers. Perform moisture-free cold probing with optional Controlled Environment Enclosure

• See the TP03500 ThermoChuck Datasheet
   

Modular System:

The TP03500 System controller operates with the user's choice of:

1) ThermoChuck Diameter
2) ThermoChuck Surface
3) High temperature capacity
4) Low temperature capacity / cooling system
5) Power Configuration

TP03500 ThermoChuck System Configuration Table

1) ThermoChuck Diameter:
Choice of 200mm ( 8 inch) or 300mm ( 12 inches) to accommodate wafers up to 300mm in diameter.

2) ThermoChuck Surface:
  Choice of Gold-plated or nickel-plated surface is standard. (Other surface treatments are optional; contact Temptronic).

3) High Temperature Capacity:
  (See ThermoChuck System Configuration Table.)
  200 mm ThermoChuck: Choice of 200ºC, 300C or 400ºC
  300 mm ThermoChuck: Choice of 200ºC or 300ºC

4) Low Temperature Capacity
  Choice of Chiller: see TP03500 Configuration Table.

5) Available in a full range of power configurations. Contact Temptronic for details

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Temptronic Corporation info@temptronic.com